2020-03-17
2020-03-09
Thermal Grade Diamand Wafers and Slices
Diamond exhibits the highest thermal conductivity among all materials. Its thermal
conductivity is up to 2000 W/mK which is higher a lot than that of copper. Therefore
diamond wafers and slices become more and more popular in thermal management as
heatspreaders,heatsinks, lithographically patterned metallization, electrical isolation
between top and bottom metallization, stress relieving slits for stress free mounting etc.
CVD diamond heat spreaders in various shapes,and the typical parameters are as
follows:
|
Material thermal conductivity >1000 W/mK |
|
Diameter Up to 70mm |
|
Surface Polished, lapping, as-cut |
|
Thickness 100 - 1500 µm |
|
Young's modulus 1000-1100Gpa |
|
Density 3.5g/cm3 |
|
Optical grade diamond wafers |
Optical grade diamond wafers are used as window for infrared beam splitters, lenses for
terahertz spectroscopy and CO2 laser surgery,Brewster Windows for multi-spectral
applications such as free electron lasers, multi-wavelength IR lasers or terahertz optical
systems,for Units attenuated total reflection) spectroscopy,for diamond Liquid Cells.
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