Diamond wafers

Thermal Grade Diamand Wafers and Slices Diamond exhibits the highest thermal conductivity among all materials. Its thermal conductivity is up to 2000 W/mK which is higher a lot than that of copper. Therefore diamond wafers and slices become more and more popular in thermal management as heatspreaders,heatsinks, lithographically patterned metallization, electrical isolation between top and bottom metallization, stress relieving slits for stress free mounting etc. CVD diamond heat spreaders in various shapes,and the typical parameters are as follows: Material                                                thermal conductivity >1000 W/mK Diameter                                              Up to 70mm Surface                                                Polished, lapping, as-cut Thickness                                                 100 - 1500 µm Young's modulus                                       1000-1100Gpa Density                                                 3.5g/cm3 Optical                                                 grade diamond wafers Optical grade diamond wafers are used as window for infrared beam splitters, lenses for terahertz spectroscopy and CO2 laser surgery,Brewster Windows for multi-spectral applications such as free electron lasers, multi-wavelength IR lasers or terahertz optical systems,for Units attenuated total reflection) spectroscopy,for diamond Liquid Cells.